Payment & Shipping Terms:
|Raw Material:||Fr - 4||Layer Count:||2 Layer|
|Board Thickness:||1.6MM||Copper Thickness:||1 Oz / 35 µm|
|Surface Treatment:||ENIG||Solder Mask:||Green|
|Board Size:||300 * 300 Mm||Min. Aperture:||0.4MM|
|Min. Line Trace Width/Space:||4Mil/4Mil|
Double Sided PCB FR4 Green Immersion Tin Custom Multilayer Printed Circuit PCB Board
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
The mechanical properties of epoxy glass fiber cloth substrate, size stability, impact resistance, moisture resistant to higher than paper substrate. Its excellent electrical performance, high working temperature, itself performance affected by environment. On the processing technology, than other resin fiberglass cloth substrate has great superiority
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
|1||Layer:||1 to 24 layers|
|2||Material type:||FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers|
|3||Board thickness:||0.20mm to 3.4mm|
|4||Copper thickness:||0.5 OZ to 4 OZ|
|5||Copper thickness in hole:||>25.0 um (>1mil)|
|6||Max. Board Size:||(580mm×1200mm)|
|7||Min. Drilled Hole Size:||4mil(0.1mm)|
|8||Min. Line Width:||3mil (0.075mm)|
|9||Min. Line Spacing:||3mil (0.075mm)|
|10||Surface finishing:||HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|11||Solder Mask Color:||Green/Yellow/Black/White/Red/Blue|
|13||Hole tolerance:||PTH: ±0.076 NPTH: ±0.05|
|14||Package:||Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing|
|16||Special requirements:||Buried and blind vias+controlled impedance +BGA|
|17||Profiling:||Punching, Routing, V-CUT, Beveling|
1. Professional PCB manufacturer.
2. PCBA,OEM,ODM service are provided.
3. Gerber file needed.
4. Products are 100% E-tested.
5. Quality guarantee and professional after-sale service
|PRODUCTION CAPABILITY OF PCB|
PRODUCTION CAPABILITY Manufacturing Capability
|Production Type||Layer Count||2L-16L|
|Surface Treatment||HAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL
|Cut Lamination||Max. Working Panel size||1000×1200mm|
|Inner Layer||Internal Core Thickness||0.1～2.0mm|
|Internal width/spacing||Min: 4/4mil|
|Internal Copper Thickness||1.0~3.0oz|
|Dimension||Board Thickness Tolerance||±10%|
|Drilling||Manufacture Panel Size||Max: 650×560mm|
|Hole Diameter Tolerance||±0.05mm|
|Hole Position Tolerance||±0.076mm|
|PTH+Panel Plating||Hole Wall copper Thickness||≧20um|
|Outer Layer||Track Width||Min: 0.08mm|
|Track Spacing||Min: 0.08mm|
|Pattern Plating||Finished Copper Thickness||1oz～3oz|
|EING/Flash Gold||Nickel Thickness||2.5um~5.0um|
|Solder Mask Bridge||3mil|
|Legend||Line width/Line spacing||6/6mil|
|Gold Finger||Nickel Thickness||≧120u〞|
|Hot Air Level||Tin Thickness||100～300u〞|
|Routing||Tolerance of Dimension||±0.1mm|
|Remain Thickness Tolerance||±0.1mm|
|Laser Drilling Size||4mil(0.1mm)|
|Special Requirements||Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering and Gold Finger Are Acceptable
How to get quick quotation?
|Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc|
|Step 2 Also please provide us the below details for quick quotation:|
Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others
|Material brand: SY / KB / Rogers (optional)|
|Material Specification:High Tg / copper based / aluminum based or others (optional)|
|Board thickness: 0.1 - 6.0 mm|
|Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )|
|Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin|
|Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc|
|Board size and quantity|
If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
|Layer count||Sample lead time/workday||Batch lead time/workday|
|18-40L (Up to difficulty)||at least 18||at least 24|
|P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays|
Q1: I am used to designing in metric units while the website is specified in imperial units.
A: When requesting an online quote, the quote form can handle mm units as well as inches for dimensions.
Q2: How do I specify internal cutouts/milling in my design?
A: All internal cutouts/slots/milling should be specified on the same layer is the board outline. The the minimum routable slot size is 32 mils. During order time, please state this requirement in the "Special Request" section so that our CAM engineers is aware of it. This is not something we encounter.
Q3: What are the available holes sizes?
A: 14 mils to 150 mils - 1 mil increments 150 mils to 200 mils - 5 mil increments above 200 mils - holes would be routed out We only use drills in imperial units. Files submitted in metric units (mm) would be converted to imperial units (mils) and rounded up to the next mil.
Now send us your inquiry, and you will be replied within 8 hours!
Little knowledge - Consideration about PCB fabrication
When placed an order of PCBs (printed circuit boards), you should spend time to considerate the basic factors including PCB board substrate material, layer count, board size, board thickness, copper thickness, surface finish, solder mask, silkscreen, blind vias, buried vias, through-hole plating, SMT and so on. When all the factors are checked and confirmed with the engineers, we highly recommended sample tested before the real fabrication of your PCB boards. If all things go well, fabrication could be started right away. However, it may need to do some modification if customer is not satisfied with the sample.